Journal
COMPOSITES COMMUNICATIONS
Volume 29, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.coco.2021.101038
Keywords
Boron nitride; Polymer composites; Thermal conductivity; Vacuum-assisted self-assembly method; Mechanical property
Categories
Funding
- National Key R&D Program of China [2018YFE0204600]
- Shenzhen Fundamental Research Program [JCYJ20200109140822796]
- Guangdong Province Key Field R&D Program Project [2020B010190004]
- Youth Innovation Promotion Association of the Chinese Academy of Sciences [2019354]
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In this study, a BN/silicone rubber (SiR) composite with oriented BN in organosilicon matrix was successfully prepared using a vacuum-assisted self-assembly technique. The composite exhibited significantly higher thermal conductivity and excellent mechanical properties, making it suitable for thermal interface material in light-emitting diode chips heat dissipation applications.
Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the deterioration of the mechanical properties. Here, we report a feasible method to prepare a BN/silicone rubber (SiR) composite with oriented BN in organosilicon matrix via a vacuum-assisted self-assembly technique. The BN/SiR composite displays a 1270% higher (2.74 W/(m center dot K)) thermal conductivity than that of neat organosilicon matrix (0.20 W/(m center dot K)). The oriented BN nanosheets increase the polymer's adhesive force and exhibit excellent compression cycle performance. In turn, these features support its superiority as thermal interface material in the light-emitting diode chips heat dissipation application.
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