4.7 Article

Evolution of microstructures and properties leading to layer instabilities during accumulative roll bonding of Fe-Cu, Fe-Ag, and Fe-Al

Journal

MATERIALS & DESIGN
Volume 212, Issue -, Pages -

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2021.110204

Keywords

Accumulative roll bonding; EBSD; Nano-indentation

Funding

  1. Los Alamos National Laboratory (LANL) Directed Research and Development Program [20200182DR]
  2. U.S. Department of Energy's NNSA [89233218CNA000001]

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The evolution of microstructures and properties of bi-metallic laminates during cold accumulative roll bonding is influenced by both material properties and layer locations. Layer instabilities occur when there is a significant difference in hardness between Fe and fcc metals, signaling the need for processing changes once the strength ratio approaches two.
Bi-metallic laminates (bcc/fcc) containing Fe and either Cu, Ag, or Al were processed by cold accumulative roll bonding (ARB). The evolving microstructures and properties were measured using optical microcopy, electron backscatter diffraction (EBSD), and nano-indentation up to and beyond when layer instabilities are observed. The evolution of layer morphology, grain size, bulk texture, layer dependent texture, and layer dependent hardness is found to be both material dependent and layer location dependent. Ultimately, the evolving difference in layer hardness between Fe and the fcc metal resulting from the microstructure evolution causes the formation of layer instabilities with the Fe-Al exhibiting layer pinch-off at a total strain of 2.2, the Fe-Ag developing shear band instabilities at a strain of 3.2, and the Fe-Cu developing shear band instabilities at a strain of 4.5. These finding indicate that once the evolving strength ratio approaches two, processing changes, such as annealing or warm rolling, that improve the strength ratio or materials' capacity for work hardening are necessary for further processing without layer instabilities. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creative-commons.org/licenses/by-nc-nd/4.0/).

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