Promoting h-BN dispersion in cellulose-based composite by lignosulfonate for regulatable effectual thermal management

Hexagonal boron nitride (h-BN) is an excellent thermally conductive and electrically insulative material. However, the formation of heat transfer pathways of h-BN in thermal interface materials is restricted due to its poor aqueous dispersity. Herein, water-soluble lignosulfonate (LS) is used to promote the dispersion of h-BN, the phenolic hydroxyl and three-dimensional structure of LS could form hydrogen bonding or steric hindrance with h-BN under ultrasound treatment. After mixing with cellulose nanofiber (CNF), the three-dimensional thermally conductive pathways are built in LS-BN/CNF aerogel through freezedrying. The results show that the through-plane thermal conductivity of LS-BN/CNF/PVA composite with 0.2 wt% LS (LS0.2-BN/CNF/PVA) exceeds 1.22 W/mK when the h-BN/CNF ratio is 3:1 (w/w), which is 6.1fold of that of PVA film (0.20 W/mK). The initial decomposition temperature and tensile strength of LS0.2BN/CNF/PVA composite are 205 degrees C and 38.5 MPa, respectively, demonstrating acceptable thermal stability and mechanical properties for electronics as thermal interface and packing material. Overall, this work put forwards an effective approach to disperse h-BN and paves the way in developing high-performance thermal interface materials. (c) 2022 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Automated summary

This study utilizes water-soluble lignosulfonate to enhance the dispersion of hexagonal boron nitride and develops a three-dimensional thermally conductive pathway by combining it with cellulose nanofiber. The LS-BN/CNF aerogel exhibits high thermal conductivity and acceptable thermal stability and mechanical properties, making it a promising material for thermal interface applications.