Journal
MATERIALS & DESIGN
Volume 212, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2021.110180
Keywords
Additive manufacturing; Electrochemical jet surface processing; Selective laser melting; Characterization; Defect and microstructure
Categories
Funding
- National Natural Science of China (NSFC) [51905255]
- Shenzhen Knowledge Innovation Plan [JCYJ20180504165815601]
- Shenzhen High-level Innovation and Entrepreneurship Fund [KQTD20170810110250357]
- Shenzhen Science and Technology Innovation Commission [JCYJ20190809143217193]
- Project of Guangdong Provincial Department of Education [2019KTSCX152]
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This study developed an electrochemical jet surface processing method to effectively uncover defects and microstructure in parts manufactured by selective laser melting (SLM), aiming to improve the quality assurance of SLM parts.
Process-induced volume defects and unsuitable microstructure have inhibited the effective quality assur-ance of parts manufactured by selective laser melting (SLM). Elucidating the complex interaction between the process, defect/microstructure, and performance is of critical importance. In this work, we have developed and demonstrated the capabilities of an electrochemical jet surface processing (EJSP) method to easily and effectively uncover defects and unveil the crystal microstructure and fusion mechanism in SLM parts of SUS316L and AlSi10Mg respectively. Experiments show that the EJSP method is highly effective in localized three-dimensional microstructural unveiling which eliminates the need for conventional sample preparation by polishing, and internal defects and retained fusion signatures at mul-tiple layers are readily identified within seconds. Furthermore, EJSP unveils three-dimensional structural information at both micro-and nano-scale to facilitate crystallography and phase analysis. This unique approach has high potential to significantly improve qualification methods of SLM parts, which benefits in-depth research of microstructure characteristics and their formation mechanism in the SLM process with high efficiency and low cost. (c) 2021 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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