Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 degrees C, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm x 130 mm), highest resolution (1536 x 1536 pixels, 300 ppi) and lowest process temperature (100 degrees C) reported so far for the OPD based imagers.

Automated summary

A facile blade-coating process is developed for large-area deposition of uniform thick organic active layers in organic photodiodes (OPDs). A large-area semi-transparent top metal electrode is deposited using thermal evaporation with an optimal deposition rate, achieving a good balance between transparency and conductivity for top illumination integration. The maximum process temperature of the OPD is 85 degrees C, ensuring the performance of the underlying organic thin-film transistor (OTFT) is not affected. Based on this integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, which has the largest size, highest resolution, and lowest process temperature reported so far for OPD-based imagers.