4.7 Article

Enabling VCSEL-on-silicon nitride photonic integrated circuits with micro-transfer-printing

Journal

OPTICA
Volume 8, Issue 12, Pages 1573-1580

Publisher

Optica Publishing Group
DOI: 10.1364/OPTICA.441636

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Funding

  1. Horizon 2020 Framework Programme (PIX4LIFE) [688519]

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This research demonstrates the integration of bottom-emitting VCSELs onto silicon nitride PICs through micro-transfer printing method, aiming to achieve low-cost and large-scale production. The 850 nm lasers exhibit high power, low threshold, and low power consumption. Important features such as single-mode laser and tuning range are also demonstrated in this study.
New wavelength domains have become accessible for photonic integrated circuits (PICs) with the development of silicon nitride PICs. In particular, the visible and near-infrared wavelength range is of interest for a range of sensing and communication applications. The integration of energy-efficient III-V lasers, such as vertical-cavity surface-emitting lasers (VCSELs), is important for expanding the application portfolio of such PICs. However, most of the demonstrated integration approaches are not easily scalable towards low-cost and large-volume production. In this work, we demonstrate the micro-transfer-printing of bottom-emitting VCSELs on silicon nitride PICs as a path to achieve this. The demonstrated 850 nm lasers show waveguide-coupled powers exceeding 100 mu W, with sub-mA lasing thresholds and mW-level power consumption. A single-mode laser with a side-mode suppression ratio over 45 dB and a tuning range of 5 nm is demonstrated. Combining micro-transfer-printing integration with the extended-cavity VCSEL design developed in this work provides the silicon nitride PIC industry with a great tool to integrate energy-efficient VCSELs onto silicon nitride PICs. Published by The Optical Society under the terms of the Creative Commons Attribution 4.0 License.

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