Related references
Note: Only part of the references are listed.Study on mechanical properties and constitutive model of 5052 aluminium alloy
Ping Song et al.
MATERIALS SCIENCE AND TECHNOLOGY (2019)
The constitutive behavior of Ti-5Al-3V-2Cr-2Fe under high-velocity impact: Experimental, modeling, and validation
Ping Song et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates
Xu Chen et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Properties and Microstructures of Sn-Bi-X Lead-Free Solders
Fan Yang et al.
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2016)
Microstructure and mechanical properties of Sn-xBi solder alloy
Dan Ye et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2015)
Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints
Xiaowu Hu et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2014)
Improvement of mechanical properties of Sn-58Bi alloy with multi-walled carbon nanotubes
He Peng et al.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA (2012)
Microstructure and mechanical properties of Sn-Bi Alloy treated in the semi-solid state by mechanical stirring process
Feng Li et al.
ADVANCES IN COMPOSITES, PTS 1 AND 2 (2011)
Microstucture and mechanical properties of semi-solid Sn-58Bi Alloy
Yongjun Hu et al.
MATERIALS ENGINEERING FOR ADVANCED TECHNOLOGIES, PTS 1 AND 2 (2011)
Thermal and mechanical properties of Sn-Zn-Bi lead-free solder alloys
A. A. El-Daly et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Influence of temperature and strain rate on the mechanical behavior of three amorphous polymers: Characterization and modeling of the compressive yield stress
J Richeton et al.
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES (2006)
Share Paper
