4.6 Article

Polymer dielectric films exhibiting superior high-temperature capacitive performance by utilizing an inorganic insulation interlayer

Journal

MATERIALS HORIZONS
Volume 9, Issue 4, Pages 1273-1282

Publisher

ROYAL SOC CHEMISTRY
DOI: 10.1039/d1mh01918j

Keywords

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Funding

  1. National Natural Science Foundation of China [51807042]
  2. Outstanding Youth Fund of Heilongjiang Province [YQ2020E031]
  3. China Postdoctoral Science Foundation [2021T140166, 2018M640303]
  4. Youth Innovative Talents Training Plan of Ordinary Undergraduate Colleges in Heilongjiang [UNPYSCT-2020178]

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A facile but effective method is proposed to improve high temperature capacitive performance in this paper. It is reported that utilizing an inorganic insulation interlayer can significantly increase the discharge energy density with a high efficiency above 90% at 150 degrees C, which provides great inspiration for developing polymer dielectric films with high capacitive performance under extreme environments.
With the rapid development of next-generation electrical power equipment and microelectronics, there is an urgent demand for dielectric capacitor films which can work efficiently under extreme conditions. However, sharply increased electrical conduction and drastically degrading electric breakdown strength are inevitable at elevated temperatures. Herein, a facile but effective method is proposed to improve high temperature capacitive performance. We report that utilizing an inorganic insulation interlayer can significantly increase the discharge energy density with a high efficiency above 90% at 150 degrees C, i.e., a discharged energy density of 4.13 J cm(-3) and an efficiency of >90% measured at 150 degrees C, which is superior to the state-of-the-art dielectric polymers. Combining the experimental results and computational simulations reveals that the remarkable improvement in energy storage performance at high temperature is attributed to the blocking effects that reduce the leakage current and maintain the breakdown strength. The proposed facile method provides great inspiration for developing polymer dielectric films with high capacitive performance under extreme environments.

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