Journal
POLYMERS
Volume 13, Issue 19, Pages -Publisher
MDPI
DOI: 10.3390/polym13193259
Keywords
thermal pads; thermal interface material; composite; heat transfer; aluminum oxide; zinc oxide; copper
Categories
Funding
- Doosung Industrial Co., Ltd.
- Korea Institute of Energy Technology Evaluation and Planning (KETEP) of the Republic of Korea [20204030200060]
- Ministry of Trade, Industry and Energy (MOTIE) of the Republic of Korea [20204030200060]
- Soonchunhyang University
- Korea Evaluation Institute of Industrial Technology (KEIT) [20204030200060] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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This study systematically investigated the effects of small ceramic and metallic powders on the thermal conductivity of rubbery thermal composite pads. By optimizing the composition of fillers, a high thermal conductivity of 2.466 W/m.K was achieved for the composite pads with copper powder replacing aluminum oxide fillers. The distribution of all fillers in the rubbery composite pads was confirmed to be even through SEM images and EDS mapping.
Thermal interface materials (also known as thermal pads) are widely used as a crucial part to dissipate heat generated in miniaturized and integrated electronic components. Here, we systematically investigated the effects of small ceramic and metallic powders in rubbery thermal composite pads with a high content of aluminum oxide filler on the thermal conductivity of the composite pads. We optimized the compositions of aluminum oxide fillers with two different sizes in a polydimethylsiloxane (PDMS) matrix for rubbery composite pads with a high thermal conductivity. Based on the optimized compositions, zinc oxide powder or copper powder with an average size of 1 mu m was used to replace 5 mu m-sized aluminum oxide filler to examine the effects of the small ceramic and metallic powders, respectively, on the thermal conductivity of the composite pads. When zinc oxide powder was used as the replacement, the thermal conductivity of the rubbery composite pads decreased because more air bubbles were generated during the processing of the mixed paste with increased viscosity. On the other hand, when the copper powder was used as a replacement, a thermal conductivity of up to 2.466 W/m.K was achieved for the rubbery composite pads by optimizing the mixing composition. SEM images and EDS mapping confirmed that all fillers were evenly distributed in the rubbery composite pads.
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