Journal
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume 11, Issue 10, Pages 1645-1654Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2021.3110425
Keywords
Microchannels; Heating systems; Heat sinks; Fluctuations; Manifolds; Uncertainty; Fluids; Adaptive vapor venting; cooling overdesign; flow boiling; thermal management; two-phase instabilities
Categories
Funding
- IIT Bombay
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The study demonstrates that introducing an adaptive vapor venting strategy can effectively eliminate temperature fluctuations during flow boiling in microchannels, without the need for cooling overdesign, thus improving thermal management efficiency and reliability.
Efficient thermal management is crucial for enhancing the performance and reliability of electronic devices. In this regard, flow boiling with microchannels promises high heat dissipation capability for a nominal temperature budget as it inherently takes advantage of high latent heat of vaporization along with high surface-area-to-volume ratio. However, the promise of high heat dissipation in flow boiling microchannels is limited by two-phase flow instabilities which cause large-amplitude temperature and pressure fluctuations. The current state-of-the-art thermal management techniques for enhancing heat transfer during flow boiling in microchannels operate in steady-state condition and provide sufficient continuous cooling to address the peak thermal loads. While such approaches can manage the thermal challenge, they result in significant cooling overdesign. To eliminate the overdesign, we introduce an adaptive vapor venting strategy which continuously adjusts to the varying vapor generation across different heat fluxes to completely mitigate two-phase fluctuations. Our results demonstrate that significant transient temperature fluctuations (+/- 5 degrees C) in the conventional microchannels were completely eliminated with the incorporation of the adaptive vapor venting (within the experimental uncertainty). Furthermore, our results show that this strategy has the capability to handle transience and accordingly avoid the need for cooling overdesign.
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