Journal
SURFACE & COATINGS TECHNOLOGY
Volume 425, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2021.127687
Keywords
TiSiN coating; Microstructure; Mechanical response; Scratch behaviour; Tribological performance; Indentation response
Funding
- Australian Government Research Training Program Scholarship
- Australian Research Council Discovery Program [DP200103152]
- UNSW
- Australian Research Council [DP200103152] Funding Source: Australian Research Council
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The study investigates the deformation mechanisms of TiSiN coatings prepared at different bias voltages, showing that coatings deposited at lower bias voltage have higher hardness and improved scratch resistance.
TiSiN coatings were synthesised onto AISI M42 tool steel substrates via closed field unbalanced magnetron sputtering ion plating, using bias voltages of -40 and -50 V. The aim of this study is to investigate the underlying deformation mechanisms of TiSiN coatings, prepared at two different substrate bias voltages, following scratching, wear and indentation tests. A graded columnar microstructure evolved in these coatings. A hardness value of similar to 30.2 GPa was determined in the coating prepared at the lower bias voltage (i.e., -40 V), which was correlated to the fine nanocomposite structure and the presence of a high compressive residual stress. Of note, for the coating deposited at -40 V enhanced scratch adhesion strength, i.e., higher critical loads (L-c1 and L-c2) against cohesive and adhesive failure were determined with the higher H/E-r and H-3/E-r(2) values. The improved scratch resistance was ascribed to the hierarchical structure that hindered crack propagation in the TiSiN coatings during progressive loading. An approximately 21% decrease in wear rate was obtained at the lower bias voltage, which was attributed to the slightly lower Si concentration (similar to 8.3 at.%) and, in turn, higher hardness. Deformation behaviour under indentation loading was dominated by shear sliding along the columnar grain boundaries.
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