Journal
SOLID-STATE ELECTRONICS
Volume 186, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.sse.2021.108042
Keywords
SiC diode; Schottky barrier; Diffusion; Power device
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By investigating the effects of annealing temperature and metal thickness on the Schottky barrier height in Ti/4H-SiC rectifiers, controlled lowering of the barrier height has been achieved, potentially improving efficiency in terms of power consumption.
In this work, we investigated the effects of annealing temperature and metal thickness on the Schottky barrier height in state-of-the-art Ti/4H-SiC rectifiers. By varying these two parameters, a controlled lowering of the Schottky barrier height has been obtained, thus giving the possibility to improve the efficiency of device in terms of power consumption.
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