Journal
PROGRESS IN PHOTOVOLTAICS
Volume 31, Issue 4, Pages 327-340Publisher
WILEY
DOI: 10.1002/pip.3545
Keywords
efficiency potential; passivating contacts; POLO; poly-Si; solar cell development; temperature coefficient
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ISFH is following a distinct cell development roadmap, which combines an n-type doped electron-collecting poly-Si on oxide junction with an Al-alloyed p(+) junction for hole collection. Recent progress and specific conceptual aspects of this technology are discussed, along with a simulation-based sensitivity analysis. The article also presents a concept to reduce the gap between measured pseudo fill factor values and theoretically achievable values.
ISFH is following a distinct cell development roadmap, which comprises-as a short-term concept-the combination of an n-type doped electron-collecting poly-Si on oxide (POLO) junction with an Al-alloyed p(+) junction for hole collection. This combination can be integrated either in front- and back-contacted back junction cells (POLO-BJ) or in interdigitated back-contacted cells (POLO-IBC). Here, we present recent progress with these two cell concepts. We report on a certified M2-sized 22.9% efficient POLO-BJ cell with a temperature coefficient TC eta of only -(0.3 +/- 0.02) %(rel)/K and a certified 23.7% (4 cm(2) d.a.) efficient POLO-IBC cell. We discuss various specific conceptual aspects of this technology and present a simulation-based sensitivity analysis for quantities related to the quality of the hole-collecting alloyed Al-p(+) junction which are subject to continuous improvement and thus hard to predict exactly. We report that the measured pseudo fill factor values decrease more due to metallization than would be expected from recombination in the metallized regions with an ideality factor of one only. The gap to pseudo fill factor values that are theoretically achievable at the respective open-circuit voltages is 1.1%(abs) (Ga-doped wafer) for POLO-IBC and 1.4%(abs) (B-doped wafer) to 2%(abs) (Ga-doped wafer) for POLO-BJ. With an embedded blocking layer for Ag crystallites in the poly-Si, we present a concept to reduce this gap.
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