Journal
POWDER TECHNOLOGY
Volume 391, Issue -, Pages 198-205Publisher
ELSEVIER
DOI: 10.1016/j.powtec.2021.06.006
Keywords
Centrifuge technique; Particle adhesion; Surface element integration; Surface roughness; Powder characterization
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Funding
- US National Science Foundation through the Engineering Research Center for Struc-tured Organic Particulate Systems [EEC0540855]
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Through simulations of the centrifuge technique, it was found that the adhesion behavior of rough powder can be described using an equivalent powder of smooth spherical particles. These results demonstrate the capability of the enhanced centrifuge technique for advanced powder characterization.
Many industries process and manufacture powders and have to account for powder adhesion. Therefore, tools that predict powder behavior based on particle scale measurements are beneficial to industry. Simulations of the centrifuge technique, utilizing substrates with hemispherical indentations, were performed to extend the powder characterization capabilities of the technique. These simulations used a simulated rough powder, modeled as spheres with sinusoidal topography, to determine the percentage of particles remaining as a function of centrifuge rotational speed, indentation size, and particle size. It was discovered that an equivalent powder of smooth spherical particles could be used to describe the adhesion behavior of the rough powder by establishing a size-dependent effective Hamaker constant distribution. This development made it possible to describe the surface roughness effects of the powder through one adjustable distributed parameter. These results demonstrate the capability of the enhanced centrifuge technique for advanced powder characterization. (c) 2021 Elsevier B.V. All rights reserved.
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