Journal
POLYMER
Volume 240, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.polymer.2021.124489
Keywords
Epoxy resin; Ring-opening polymerization; Lactide; Thermosetting
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This study investigates a new thermal curing system for epoxy resins by examining the ring-opening copolymerization of glycidyl phenyl ether (GPE) and D,L-lactide (LAC). The results suggest that the produced poly(GPE-co-LAC) is a gradient copolymer with improved thermal stability and increased cross-linking density. This new system shows potential for various industrial applications.
We examined the ring-opening copolymerization of glycidyl phenyl ether (GPE) and D,L-lactide (LAC) to afford poly(GPE-co-LAC) as a model reaction of the LAC-mediated thermal curing of epoxy resins such as 2,2-bis(4-glycidyloxyphenyl)propane (BGP), 2,2-bis(4-glycidyloxyphenyl)methane (BGM), 3,3'5,5';-tetramethyl-4,4'-diglyci-dyloxybiphenyl (TDP), N,N-diglycidyl-4-glycidyloxyaniline (DGA), and oligo phenols (NC-3000 and EPPN502H). The reaction of GPE and LAC proceeded efficiently in the presence of 1,8-diazabicyclo[5.4.0]undec-7ene (DBU) at 180 ? for 2 h. The monomer reactivities r1 of LAC and r(2) of GPE calculated according to the Fineman-Ross method and the Kelen-Tudos method were 0.85 and 1.26, respectively. The relatively small difference between these values suggests that the produced poly(GPE-co-LAC) would be a gradient copolymer, different from a block copolymer or random copolymer. Based on these results, we examined the thermal curing reactions of epoxy resins BGP, BGM, TDP, DGA, NC-3000, and EPPN-502H in bulk under the same conditions. The corresponding cured products were obtained quantitatively. The thermal stability of BGP, BGM, DGA, and EPPN-502H was increased by the addition of a small amount of LAC, suggesting that the cross-linking density of the cured products was increased. This new class of thermal curing system should be applicable to epoxy resins used in various industrial applications.
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