Journal
NANOTECHNOLOGY
Volume 33, Issue 16, Pages -Publisher
IOP Publishing Ltd
DOI: 10.1088/1361-6528/ac4664
Keywords
perforated template; polymeric residues; graphene; suspended membrane
Funding
- Technology Innovation Program - Ministry of Trade, Industry & Energy (MOTIE, Korea) [20011317]
- Korea Institute of Machinery and Materials [NK230D]
- Korea Evaluation Institute of Industrial Technology (KEIT) [20011317] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
- National Research Council of Science & Technology (NST), Republic of Korea [NK230D] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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A residue-free transfer method for graphene is proposed using perforated polymer templates, allowing precise transfer onto specific positions on SiO2/Si substrates without the need for polymer removal or thermal annealing. The transferred graphene surface was analyzed and confirmed to have no polymeric residues. This method enables the transfer of 2D materials for device applications and physical characterizations without concerns of contaminants.
A residue-free transfer method for graphene is proposed in this study, especially for the fabrication of suspended structures. Using perforated polymer templates, graphene can be precisely transferred onto the specific position in the perforated target SiO2/Si substrates without the need for polymer removal and the subsequent thermal annealing process. The surface of the transferred graphene by the proposed method was analyzed and corroborated via Raman spectroscopy, Fourier transform infrared spectroscopy, transmission electron microscopy. The results of these analyses suggest that the graphene surface has no polymeric residues resulting from the transfer process. The proposed method provides a powerful approach for the transfer of 2D materials and it enables the exploitation of their suspended structures for device applications as well as the physical characterizations without worry on the effect of contaminants.
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