Effect of nanostructure on explosive boiling of thin liquid water film on a hot copper surface: a molecular dynamics study

The explosive boiling characteristics of water on the copper surface are studied based on molecular dynamics simulation. The effects of the size, number and shape of nanostructures on the heat transfer performance of water explosive boiling are analysed. The results show that the heat transfer performance and boiling rate of liquid film increase with the increase of nanostructure size. At the same volume concentration of nanostructures, the boiling rate of the liquid film increases with the increase of the number of nanostructures. Compared with the spherical nanostructure, the water heating rate is higher and the heat flux of water is larger after the cylindrical nanostructure is adopted. Therefore, using cylindrical nanostructures and increasing, the uniformity of nanostructures on the surface can effectively improve the boiling heat transfer performance of water on the copper surface.

Automated summary

The explosive boiling characteristics of water on the copper surface were studied using molecular dynamics simulation, showing that increasing the size of nanostructures improves heat transfer performance and boiling rate. Additionally, increasing the number of nanostructures at the same volume concentration can also increase the boiling rate of the liquid film. The adoption of cylindrical nanostructures results in higher water heating rates and larger heat flux compared to spherical nanostructures, demonstrating the potential for improving boiling heat transfer performance on copper surfaces.