Improvement method of high-temperature digital image correlation measurement accuracy based on image processing

Article Optics

High-temperature digital image correlation techniques for full-field strain and crack length measurement on ceramics at 1200°C: Optimization of speckle pattern and uncertainty assessment

Robert Kaczmarek et al.

Summary: This study focuses on high-temperature mechanical tests coupled with Digital Image Correlation (DIC) on ceramics, addressing challenges such as thermal resistance of the speckle pattern and black body radiation. An experimental procedure was specifically designed to minimize disturbances and select a suitable speckle pattern for mechanical characterization at 1200 degrees C. Results show that a speckle pattern with fine silicon carbide powder provides the best representation of crack progression during fracture behavior analysis, revealing more crack branching at high temperatures compared to room temperature.

OPTICS AND LASERS IN ENGINEERING (2021)

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Correction Engineering, Multidisciplinary

Change of Exposure Time Mid-Test in High Temperature DIC Measurement (vol 31, 075402, 2020)

Thinh Q. Thai et al.

Summary: This study reveals that changes in temperature cause uniform offsets in lighting in high-temperature DIC measurements, which have important implications for correlation algorithms. The research recommends always selecting the ZNSSD algorithm to correct for both offsets and linear scaling in extreme temperature DIC measurements.

MEASUREMENT SCIENCE AND TECHNOLOGY (2021)

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Article Engineering, Multidisciplinary