Journal
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
Volume 273, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.mseb.2021.115436
Keywords
Micro-supercapacitor; PCB; Copper oxide nanowire; Interdigital
Funding
- dual-beam FIB-SEM under the FIST program [SR/FST/ETII-023/2012C]
- DST [DST/TMD/MES-TS/2K17/24(G)(C)]
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This study reports the development of copper oxide nanowire micro-supercapacitors on a printed circuit board (PCB) using a simple pattern transfer and electrochemical forming protocol, with impressive performance parameters in a solid-state PVA-H2SO4 gel electrolyte. The results demonstrate the potential of directly patterning PCBs on a large scale into nanostructured microelectrodes for micro-supercapacitor applications and meeting the power requirements of microelectronic devices.
Micro-supercapacitors, as micro-scale energy storage units, are envisaged to provide the necessary power to miniaturized electronics. Here we report, copper oxide nanowire micro-supercapacitors, developed on a printed circuit board (PCB), following a facile pattern transfer and electrochemical forming protocol. In this way, a PCB can be patterned into a largescale interdigital electrode array, on which copper oxide nanowires can be grown electrochemically in a single step. The copper oxide nanowires micro-supercapacitor demonstrated a maximum areal capacitance of 257 mF cm(-2) (659 mF cm(-2) in aqueous KOH solution), maximum energy density 35 mu Wh cm(-2) and power density 5.2 mW cm(-2) in the solid-state PVA-H2SO4 gel electrolyte. The significant performance parameters showed the potential of direct patterning of PCB to nanostructure microelectrodes on a large scale for micro-supercapacitor application and its potential to fulfill the power requirement of microelectronics devices.
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