In-situ tensile damage and fracture behavior of PIP SiC/SiC minicomposites at room temperature

In-situ tensile damage and fracture behavior of original SiC fiber bundles, processed and uncoated SiC fiber bundles, SiC fiber bundle with PyC interphase, SiC/SiC minicomposites without/with PyC interphase are analyzed. Relationships between load-displacement curves, stress-strain curves, and micro damage mechanisms are established. A micromechanical approach is developed to predict the stress-strain curves of SiC/SiC minicomposites for different damage stages. Experimental tensile stress-strain curves of two different SiC fiber reinforced SiC matrix without/with interphase are predicted. Evolution of composite's tangent modulus, interface debonding fraction, and broken fiber fraction with increasing applied stress is analyzed. For the BXTM and Cansas-3303TM SiC/SiC minicomposite with interphase, the composite's tangent modulus decreased with applied stress especially approaching tensile fracture; the interface debonding fraction increased with applied stress, and the composite's tensile fracture occurred with partial interface debonding; and the broken fiber fraction increased with applied stress, and most of fiber's failure occurred approaching final tensile fracture.

Automated summary

This study analyzed the tensile damage and fracture behavior of various SiC fiber bundles and composites, establishing relationships between load-displacement curves, stress-strain curves, and micro damage mechanisms. Predictions were made for the performance changes of the composites at different damage stages.