Journal
JOURNAL OF NON-CRYSTALLINE SOLIDS
Volume 576, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.jnoncrysol.2021.121272
Keywords
Thermally conductive composites; Ceramic-based composites; Polymer-matrix composites; Manufacturing; Processing
Funding
- National Research Foundation (NRF) of Korea - Ministry of Science, Information and Communications Technology [NRF-2019K1A3A1A47000624, 2019K1A3A1A25000230]
- National Research Foundation of Korea [2019K1A3A1A47000624, 2019K1A3A1A25000230] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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This review summarizes the research advances in improving the heat dissipation properties of thermally conductive ceramic filler networking composites, focusing on structural engineering applications and fabrication methods. It also discusses the existing issues and future perspectives of these composites.
Three-dimensional (3D) ceramic filler networking composites feature isotropic heat dissipation properties owing to the spatial distribution of their fillers, which form continuous thermal conduction paths that ensure a high thermal conductivity. Therefore, this type of filler networking is considered ideal in thermally conductive ceramic-filler-based composites. This review discusses the research advances achieved thus far for improving the heat dissipation properties of thermally conductive ceramic filler networking composites, with a special focus on structural engineering applications. The most popular methods for fabricating composites with 3D filler networking are also examined. Finally, existing issues and future perspectives associated with the use of these composites are considered.
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