Journal
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 96, Issue -, Pages 199-211Publisher
JOURNAL MATER SCI TECHNOL
DOI: 10.1016/j.jmst.2021.03.085
Keywords
Surface roughness; Rotational dynamic recrystallization; EBSD; Geometrically necessary dislocations; Mechanical properties
Funding
- National Key Research and Development Program [2018YFA0702900]
- Postdoctoral Science Foundation of China [2020M681004]
- National Natural Science Foundation of China [51774265]
- National Science and Technology Major Project of China [2019ZX06004010]
- Strategic Priority Research Program of the Chinese Academy of Sciences [XDC04000000]
- LingChuang Research Project of China National Nuclear Corporation
- Program of CAS Interdisciplinary Innovation Team
- Youth Innovation Promotion Association, CAS
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Surface roughness affects the interfacial dynamic recrystallization kinetics and mechanical properties of hot-compression bonding joints of Ti-6Al-3Nb-2Zr-1Mo. Rough surfaces lead to the formation of elongated grains with lower elongation compared to polished surfaces. A rotational dynamic recrystallization mechanism is proposed to explain the formation of fine interfacial recrystallization grains during bonding of rough surfaces.
The influence of surface roughness on the interfacial dynamic recrystallization kinetics and mechanical properties of Ti-6Al-3Nb-2Zr-1Mo hot-compression bonding joints was systematically investigated. It is found that for the bonding interface of rough surfaces, elongated fine grains are formed at the bonding interface due to shear deformation of the interfacial area. As the surface roughness increases, the proportion of elongated grains drastically decreases as they further reorient to form equiaxed grains along the bonding interface of rougher surfaces resulting from severe incompatible deformation of the interface area. Meanwhile, high-density geometrically necessary dislocations accumulate around the interfacial recrystallization area to accommodate the incompatible strain and lattice rotation. A rotational dynamic recrystallization mechanism is thereby proposed to rationalize the formation of fine interfacial recrystallization grains during bonding of rough surfaces. In contrast to that of rough surfaces, bonding interface of polished surfaces exists in the form of straight interface grain boundaries without fine grains under the same deformation conditions. While with the increase of deformation strain, small grain nuclei form along the bonding interface, which is associated with discontinuous dynamic recrystallization assisted by strain-induced boundary migration of interface grain boundaries. Moreover, the bonding joints of rough surfaces show lower elongation compared with that of polished surfaces. This is because the formation of heterogeneous fine grains with low Schmid factor along the bonding interface of rough surfaces, leading to worse compatible deformation capability and thereby poor ductility of bonding joints. (c) 2022 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
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