4.6 Article

Glassy carbon manufacture using rapid photonic curing

Journal

JOURNAL OF MATERIALS SCIENCE
Volume 57, Issue 1, Pages 299-310

Publisher

SPRINGER
DOI: 10.1007/s10853-021-06648-w

Keywords

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Funding

  1. EPSRC (Engineering and Physical Sciences Research Council) [EP/N509553/1, EP/N013727/1]
  2. European Regional Development Fund through the Welsh Government [80708]
  3. EPSRC [EP/M028267/1]
  4. EPSRC vis SPECIFIC [EP/N020863/1]
  5. EPSRC [EP/N020863/1, EP/M028267/1, EP/N013727/1] Funding Source: UKRI

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Photonic curing was investigated as a rapid method for producing glassy carbon coatings, significantly reducing processing time from 20 hours to 1 minute. The coatings showed resilience and smoothness, making them suitable for various applications.
Photonic curing was explored as a rapid method for producing glassy carbon coatings, reducing processing time from similar to 20 h for conventional thermal processing down to similar to 1 min. A resole-type thermoset polymer resin coated on steel foil was used as a precursor, placed in a nitrogen purged container and exposed to high energy light (similar to 27 J/cm(2) per pulse for up to 20 pulses). Comparison samples were produced at 800 degrees C using a conventional nitrogen purged thermal route. For both photonic and conventionally produced coatings, Raman spectroscopy and primary peak XPS data showed sp(2) bonded carbon, indicative of bulk glassy carbon. This transformation evolved with increasing number of pulses, and therefore amount of energy transferred to the coating. The produced coatings were resilient, highly smooth, with no evidence of surface defects. XPS analysis indicated greater sp(3) content at the immediate surface (5-10 nm) for photonic cured carbon compared with thermally cured carbon, likely due to the local environment (temperature, atmosphere) around the surface during conversion. The ability to rapidly manufacture glassy carbon coatings provides new opportunities to expand the window of applications of glassy carbons in coatings towards large-scale high volume applications.

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