Related references
Note: Only part of the references are listed.Indentation creep vs. indentation relaxation: A matter of strain rate definition?
Paul Baral et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2020)
A new nanoindentation creep technique using constant contact pressure
Olena Prach et al.
JOURNAL OF MATERIALS RESEARCH (2019)
A new long-term indentation relaxation method to measure creep properties at the micro-scale with application to fused silica and PMMA
P. Baral et al.
MECHANICS OF MATERIALS (2019)
Strain Rate Contribution due to Dynamic Recovery of Ultrafine-Grained Cu-Zr as Evidenced by Load Reductions during Quasi-Stationary Deformation at 0.5 Tm
Wolfgang Blum et al.
METALS (2019)
New flat-punch indentation creep testing approach for characterizing the local creep properties at high temperatures
D. Matschkal-Amberger et al.
MATERIALS & DESIGN (2019)
On the Measurement of Power Law Creep Parameters from Instrumented Indentation
P. Sudharshan Phani et al.
JOM (2017)
Influence of solid solution strengthening on the local mechanical properties of single crystal and ultrafine-grained binary Cu-AlX solid solutions
Verena Maier-Kiener et al.
JOURNAL OF MATERIALS RESEARCH (2017)
Mechanically-induced grain coarsening in gradient nano-grained copper
W. Chen et al.
ACTA MATERIALIA (2017)
A direct comparison of high temperature nanoindentation creep and uniaxial creep measurements for commercial purity aluminum
P. Sudharshan Phani et al.
ACTA MATERIALIA (2016)
Time, stress, and temperature-dependent deformation in nanostructured copper: Stress relaxation tests and simulations
Xu-Sheng Yang et al.
ACTA MATERIALIA (2016)
Grain size and alloying effects on dynamic recovery in nanocrystalline metals
Z. Sun et al.
ACTA MATERIALIA (2016)
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Xu-Sheng Yang et al.
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2016)
Plastic deformation behavior during unloading in compressive cyclic test of nanocrystalline copper
Jiangjiang Hu et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Interpretation of unloading tests on nanocrystalline Cu in terms of two mechanisms of deformation
Wolfgang Blum et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Dynamic recovery in nanocrystalline Ni
Z. Sun et al.
ACTA MATERIALIA (2015)
Influence of dislocation-solute atom interactions and stacking fault energy on grain size of single-phase alloys after severe plastic deformation using high-pressure torsion
Kaveh Edalati et al.
ACTA MATERIALIA (2014)
An improved long-term nanoindentation creep testing approach for studying the local deformation processes in nanocrystalline metals at room and elevated temperatures
Verena Maier et al.
JOURNAL OF MATERIALS RESEARCH (2013)
Compressive behavior and rate-controlling mechanisms of ultrafine grained copper over wide temperature and strain rate ranges
Tao Suo et al.
MECHANICS OF MATERIALS (2013)
Experimental determination of the effective indenter shape and ε-factor for nanoindentation by continuously measuring the unloading stiffness
Benoit Merle et al.
JOURNAL OF MATERIALS RESEARCH (2012)
Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys
Yong Liu et al.
MATERIALS LETTERS (2012)
Nanoindentation strain-rate jump tests for determining the local strain-rate sensitivity in nanocrystalline Ni and ultrafine-grained Al
Verena Maier et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Constant structure creep experiments on aluminium
K. Milicka
KOVOVE MATERIALY-METALLIC MATERIALS (2011)
Deformation resistance in the transition from coarse-grained to ultrafine-grained Cu by severe plastic deformation up to 24 passes of ECAP
W. Blum et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2011)
Transition of creep mechanism in nanocrystalline metals
Yun-Jiang Wang et al.
PHYSICAL REVIEW B (2011)
A comparison between steady state creep and stress relaxation in copper
H. D. Chandler
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2010)
Creep of nanocrystalline nickel: A direct comparison between uniaxial and nanoindentation creep
C. L. Wang et al.
SCRIPTA MATERIALIA (2010)
Grain coarsening during compression of bulk nanocrystalline nickel and copper
S. Brandstetter et al.
SCRIPTA MATERIALIA (2008)
Hardness and strain rate sensitivity of nanocrystalline Cu
J Chen et al.
SCRIPTA MATERIALIA (2006)
Mechanical properties of nanocrystalline materials
MA Meyers et al.
PROGRESS IN MATERIALS SCIENCE (2006)
Creep transients during stress changes in ultrafine-grained copper
R Kapoor et al.
SCRIPTA MATERIALIA (2006)
The deformation physics of nanocrystalline metals: Experiments, analysis, and computations
MA Meyers et al.
JOM (2006)
Nano-indentation of coatings
SJ Bull
JOURNAL OF PHYSICS D-APPLIED PHYSICS (2005)
Low temperature compressive creep in electrodeposited nanocrystalline nickel
RS Kottada et al.
SCRIPTA MATERIALIA (2005)
Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures
K Zhang et al.
APPLIED PHYSICS LETTERS (2005)
Tensile properties of in situ consolidated nanocrystalline Cu
S Cheng et al.
ACTA MATERIALIA (2005)
Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals
Q Wei et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2004)
Micromechanical characterisation of the influence of rhenium on the mechanical properties in nickel-base superalloys
K Durst et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2004)
Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology
WC Oliver et al.
JOURNAL OF MATERIALS RESEARCH (2004)
Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu
YJ Li et al.
ACTA MATERIALIA (2004)
Temperature and strain rate effects on the strength and ductility of nanostructured copper
YM Wang et al.
APPLIED PHYSICS LETTERS (2003)
Understanding creep - a review
W Blum et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2002)
Creep of crystalline materials: experimental basis, mechanisms and models
W Blum
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
Creep behavior of nanocrystalline nickel at 290 and 373 K
WM Yin et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2001)
Share Paper
