4.6 Article

Reaction-composite diffusion brazing of C-SiC composite and Ni-based superalloy using mixed (Cu-Ti) plus C powder as an interlayer

Journal

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2021.117419

Keywords

C-SiC composite; Ni-based superalloy; (Cu-Ti) plus C interlayer; In-situ reaction; Transient liquid phase bonding

Funding

  1. National Natural Science Foundation of China [51875038]
  2. National Defense Pre-Research Foundation of China [61409230507, 61409230505]

Ask authors/readers for more resources

The novel process utilizing reaction-composite brazing and transient liquid phase bonding successfully achieved low-temperature bonding and high-temperature resistance for joining C-SiC composite and GH4169 superalloy. The joints showed excellent comprehensive properties, with a high melting temperature of 1052 degrees C and maximum shear strengths of 234 MPa at room temperature and 101 MPa at 900 degrees C.
Taking the advantages of reaction-composite brazing and transient liquid phase bonding (TLP), a novel process with the features of low-temperature bonding & high-temperature resisting was implemented to join C-SiC composite and GH4169 superalloy. In the new process, mixed powder of low-melting-point Cu85Ti15 alloy and carbon (C) was used as an interlayer. At a relatively low bonding temperature (990 degrees C), in-situ reaction of (Cu-Ti) (l)+C-s ->(Cu)(s)+TiCs and interdiffusion between the (Cu-Ti)(l) liquid and the GH4169 substrate concurrently occurred to transform the interlayer into a TiC-reinforced (Cu)(s) matrix composite joining layer. The low-CTE reinforcement TiC helped to alleviate the high residual stress in the joint, and the (Cu)(s) matrix provided the high-temperature resistance for the joint. In the current work, microstructural behavior, formation mechanism, heat resistance and shear strengths of the bonded joints were investigated. Results indicated that the (Cu-Ti)(l)/C-s in-situ reaction had an effect of shortening the solidification time of the joining layer, thus decreasing the formation of Ti-C and Ti-Si brittle compounds at the C-SiC side interface. The bonded joints exhibited excellent comprehensive properties: melting temperature of the joining layer reached 1052 degrees C, which was much higher than that of Cu85Ti15 alloy (898 degrees C) and the bonding temperature (990 degrees C); the maximum shear strength at room temperature and 900 degrees C reached 234 MPa and 101 MPa, respectively.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available