Journal
JOURNAL OF COMPUTATIONAL PHYSICS
Volume 442, Issue -, Pages -Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcp.2021.110499
Keywords
Multi-physics; Elastoplastic solids; Diffuse interface; Fracture; Slide; Void opening
Funding
- AWE PLC
- UK Engineering and Physical Sciences Research Council (EPSRC) [EP/L015552/1]
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The study introduces a new three-dimensional diffuse interface finite volume method for simulating multiple solid and fluid components with large deformations, sliding, and void opening. The method is straightforward to implement, cost-effective, highly parallelisable, and suitable for large-scale simulations of complex materials and physical processes.
This work outlines a new three-dimensional diffuse interface finite volume method for the simulation of multiple solid and fluid components featuring large deformations, sliding and void opening. This is achieved by extending an existing reduced-equation diffuse interface method by means of a number of novel flux-modifiers and interface seeding routines that enable the application of different material boundary conditions. The method allows for slip boundary conditions across solid interfaces, material-void interaction, and interface separation. The method is designed to be straightforward to implement, inexpensive and highly parallelisable. This makes it suitable for use in large, multi-dimensional simulations that feature many complex materials and physical processes interacting over multiple levels of adaptive mesh refinement. Furthermore, the method allows for the generation of new interfaces in a conservative fashion and therefore naturally facilitates the simulation of high-strain rate fracture. Hence, the model is augmented to include ductile damage to allow for validation of the method against demanding physical experiments. The method is shown to give excellent agreement with both experiment and existing Eulerian interface tracking algorithms that employ sharp interface methods. Crown Copyright (c) 2021 Published by Elsevier Inc. All rights reserved.
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