Low-dielectric constant and viscosity tetrafunctional bio-based epoxy resin containing cyclic siloxane blocks

Bio-based epoxy resins with low-dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high-dissociation energy, and elevated molecular volume, thereby making it useful for the synthesis of materials with low dielectric constant and viscosity. Herein, a tetrafunctional eugenol-based epoxy resin (DEP) based on a cyclosiloxane structure was designed and prepared through a hydrosilylation reaction. Allyl glycidyl ether (AGE) was selected as a reference compound and generated a silylation epoxy resin (AGDEP). The viscosity of these silicone-containing tetrafunctional epoxy monomers (< 0.315 Pa center dot s) was significantly lower than that of the conventional oil-based epoxy resin (14.320 Pa center dot s). After curing with methyl hexahydrophthalic anhydride (MHHPA), the dielectric constant of DEP-MHHPA was as low as 2.8 (10 MHz), which was superior to that of EP-MHHPA. Notably, the glass transition temperature (T-g) of DEP-MHHPA was as high as 100.3 degrees C. The tensile strength and elongation at break of DEP-MHHPA were estimated to be 66.1 MPa and 6.0%, respectively. Multifunctional eugenol-based epoxy monomers with low-dielectric constant and viscosity provide an efficient guideline for building epoxy-based materials to better design future-oriented engineering materials.

Automated summary

Multi-functional eugenol-based epoxy monomers with low dielectric constant and viscosity provide an efficient guideline for the design of future-oriented engineering materials.