Evolution of patterning materials towards the Moore's Law 2.0 Era

In this paper, the utilization of lithographic materials for semiconductor patterning applications based on optical and EUV radiation sources is reviewed. Photoresist platforms including novolac, chemically amplified, chain scission, molecular and inorganic materials are discussed in relation to their chemistry, design, processing, and performance. If the focus of Moore's Law 1.0 was on laterally scaling the number of components on a single chip, Moore's Law 2.0 can be understood as the coming era of 3D scaling, where the improved performance from 2D shrinking is replaced by integrated AI, 3D packaging, 3D transistors and new types of memory, among other enablers. As the historical patterning challenges faced by the lithographic industry to scale down semiconductor devices over multiple technology nodes are reviewed from a materials perspective, insight is given regarding future patterning materials utilization and the importance of back-implementing leading-edge materials for Moore's Law 2.0 patterning applications.

Automated summary

This paper reviews the use of lithographic materials in semiconductor patterning applications and discusses different types of photoresist platforms. It also explores the shift from Moore's Law 1.0, which focused on increasing the number of components on a chip, to Moore's Law 2.0, which emphasizes 3D scaling and integration of new technologies such as AI and 3D packaging.