Oxidized cornstarch - Urea wood adhesive for interior particleboard production

Herein, a green binder formulation which contains oxidized corn starch (OCS) and urea (U) was developed for wood-based panel production. The obtained adhesive structure was strengthened by using titanium dioxide nanoparticle (nano-TiO2). Solid content and viscosity of the synthesized adhesives were determined. Chemical, crystalline structure and morphological properties of the synthesized adhesives, native and oxidized corn starch were investigated. Moreover, laboratory scale particleboards were produced by using a hybrid adhesive system. Mechanical tests of the boards were performed to examine the quality of OCS - U based adhesive and the obtained results evaluated in dry medium (P2) according to European norms EN 312 (2010). Formaldehyde content of the boards were measured by using the perforator method. The results showed that developed OCS - U based adhesive can be used with traditional melamine urea formaldehyde resin (MUF) as a hybrid adhesive system for producing particleboards with low formaldehyde content.

Automated summary

The newly developed OCS - U based adhesive can be used in conjunction with traditional melamine urea formaldehyde resin (MUF) to produce particleboards with low formaldehyde content.