4.7 Article

Graphene double cross-linked thermally conductive hydrogel with low thermal contact resistance, flexibility and self-healing performance

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.icheatmasstransfer.2021.105537

Keywords

Thermal contact resistance; Thermal interface materials; Graphene; Hydrogel; Thermal conductivity

Funding

  1. National Natural Science Foundation of China [51876112]
  2. Shanghai Engineering Research Center of Advanced Thermal Functional Materials and Gaoyuan Discipline of Shanghai-Materials Science and Engineering

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The article introduces a novel thermal interface material obtained by incorporating graphene into a polyacrylate-based double cross-linked hydrogel, which exhibits low thermal contact resistance, high thermal conductivity, excellent elasticity, and self-healing properties, meeting the requirements of a dynamic working environment. The study found that under certain pressure, the effect of temperature on thermal contact resistance is minor, indicating the excellent thermal management performance of the composite hydrogel.
With the booming development of electronic devices usually used in a dynamic working environment, there is an urgent need for thermal interface materials with low thermal contact resistance, high thermal conductivity, excellent elasticity, and self-healing properties. A novel thermal interface material is obtained by incorporating graphene into a polyacrylate-based double cross-linked hydrogel. The introduction of graphene into the hydrogel can improve the thermal conductivity of the thermal interface material and enhance the tensile properties of the hydrogel. The composite thermally conductive hydrogel has self-healing properties, precisely meeting the thermal interface material's dynamic working environment. Besides, the effects of pressure and temperature on the thermal contact resistance are investigated. When the pressure increases from 10 Psi to 50 Psi at 35 degrees C, the thermal contact resistance is reduced to 0.069 K.cm(2)/W. Under certain pressure, the effect of temperature on the thermal contact resistance is minor. Overall, the thermal contact resistance remains low (0.5-0.9 K.cm(2)/W). The composite hydrogel is demonstrated excellent thermal management performance under the combined effect of high thermal conductivity and low thermal contact resistance by steady-state thermal analysis simulations and infrared thermography. Highly elastic, self-healing, low thermal resistance composites will present ideas for further construction of new thermal interface materials.

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