Multistructural Network Design Enables Polybenzoxazine to Achieve Low-Loss-Grade Super-High-Frequency Dielectric Properties and High Glass Transition Temperatures

An original design strategy for the preparation of thermosetting resins with both super-high-frequency low dielectric constant (k) and low dielectric loss (f) as well as high glass transition temperature (T-g) values is presented. The key to this design strategy is incorporating a bulky group and reactive furan ring to increase the free volume and the cross-linking density, respectively. The formed multistructural networks (relatively dense near furan rings and relatively loose near bulky groups) are beneficial not only for lowering k values but also for maintaining high T(g)s of main-chain benzoxazine copolymers. More importantly, the optimized copolymers possess low f values (<= 0.008) under 5 and 10 GHz, satisfying the requirement of super-high-frequency communications. The correlations between the free volume and thermal and dielectric properties are also discussed to understand the synergistic mechanism. The work opens a new route for the structural design and preparation of super-high-frequency low dielectric functional polymeric materials.

Automated summary

An original design strategy was introduced for the preparation of thermosetting resins with super-high-frequency low dielectric constant and low dielectric loss, as well as high glass transition temperature values. By incorporating a bulky group and reactive furan ring, multistructural networks were formed, resulting in lowered dielectric constants and maintained high T(g) values. The optimized copolymers exhibited low dielectric loss values under super-high-frequency communications.