4.4 Article

Analytical and Numerical Investigations on the Degradation of REBCO Based Superconducting Tapes Under Bending

Journal

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2021.3109720

Keywords

Bending; CORC cable; high temperature superconductors; intrinsic axial strain; REBCO tapes

Funding

  1. TKM College of Engineering, Kollam, Kerala, India
  2. EMS group, University of Twente, The Netherlands
  3. AICTE government of India

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This study investigates the strain variations and their impact on the electrical performance of high-temperature superconductors during the bending process using numerical simulation and analytical methods. The results show that the thickness variation of the substrate has a significant influence on induced strain.
Second-generation high-temperature superconductors, being brittle, need to be deposited on a substrate and converted to tapes with additional reinforcement layers. These tapes are wound on a core to make superconducting wires and cables. The mechanical loads during bending, twisting, winding, etc., can degrade the superconductor. It is necessary to determine the strain-induced during these processes. Variations in induced strain with bending of superconductors have been investigated analytically and numerically for various configurations of Rare-Earth Barium Copper Oxide (REBCO) tape. The numerical simulation has been carried out using COMSOL Multiphysics software; the analytical examination of the effect has been performed applying the Flexure formula. The geometrical configuration of the superconducting tape is varied in terms of the bending radius, the thickness of constituting layers made of Hastelloy and copper. The results showed that the variation in the thickness of the substrate has a large influence on the induced strain. Electrical performance analysis is also carried out using the power law of strain dependence and the 5% critical current degradation point is noted. Results of these numerical and analytical investigations are expected to help in finding out critical parameters to avoid degradation while being in use.

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