4.6 Article

Bilayer-Based Antiferroelectric HfZrO2 Tunneling Junction With High Tunneling Electroresistance and Multilevel Nonvolatile Memory

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 42, Issue 10, Pages 1464-1467

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2021.3107940

Keywords

Ferroelectric; antiferroelectric; HfZrO2

Funding

  1. Ministry of Science and Technology (MOST) [110-2218-E-003-005, 110-2218-E-A49-014-MBK, 109-2622-8-002-003]
  2. Taiwan Semiconductor Research Institute (TSRI)
  3. Nano Facility Center (NFC), Taiwan

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The bilayer-based Antiferroelectric Tunneling Junction (AFTJ) utilizing ferroelectric and dielectric materials demonstrates exceptional performance in terms of current ratio, TER, retention time, and cycling endurance, making it a promising candidate for low-power crossbar eNVM applications.
The bilayer-based Antiferroelectric Tunneling Junction (AFTJ) with ferroelectric (FE) HfZrO2 (HZO) and dielectric (DE) Al2O3 demonstrates a current ratio of >100 x, a TER (tunneling electroresistance) of >50 x, multilevel states, >10(4) sec retention, and a cycling endurance as high as 10(8). The concept of tunneling current through DE in an antiferroelectric (AFE) system enhances the capacity to modulate the current/TER ratio and makes the AFTJ feasible for low-power crossbar eNVM (embedded nonvolatile memory) applications.

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