Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 63, Issue 2, Pages 614-619Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2015.2510630
Keywords
Current collapse; GaN-on-Si; high-temperature low-damage gate recess; low-pressure chemical-vapor-deposited SiNx (LPCVD-SiNx); MIS high-electron-mobility transistors (MIS-HEMTs); normally OFF
Funding
- Fundamental Research Funds for the Central Universities [ZYGX2013J037]
- National Natural Science Foundation of China [61234006, 61404156, 61474138, 61534007, 61527816]
- Project National 1000 Young Talents Plan of China
- Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences
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Low-current-collapse normally OFF GaN-on-Si MIS high-electron-mobility transistors (MIS-HEMTs) are fabricated with low-pressure chemical-vapor-deposited SiNx (LPCVD-SiNx) passivation and high-temperature low-damage gate-recess technique. The high-thermal-stability LPCVD-SiNx enables a passivation-prior-to-ohmic process strategy and effectively suppresses deep states at the passivation/HEMT interface. The fabricated MIS-HEMTs feature a high V-TH of +0.85 V at the drain current of 1 mu A/mm and a remarkable ON/OFF current ratio of 10(10) while reduced dynamic ON-resistance as compared to plasma-enhanced chemical-vapor-deposited SiO2 passivation. High field-effect channel mobility of 180 cm(2)/V . s is achieved, leading to a high maximum drain current density of 663 mA/mm.
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