4.3 Review

A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

Journal

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2016.2617458

Keywords

Thermography; thermal simulation; GaN; GaAs; HEMT; thermal management; reliability

Funding

  1. U.K. Engineering and Physical Sciences Research Council
  2. European Space Agency
  3. European Defense Agency
  4. U.S. Office for Naval Research
  5. Engineering and Physical Sciences Research Council [1505109] Funding Source: researchfish

Ask authors/readers for more resources

We review the Raman thermography technique, which has been developed to determine the temperature in and around the active area of semiconductor devices with submicron spatial and nanosecond temporal resolution. This is critical for the qualification of device technology, including for accelerated lifetime reliability testing and device design optimization. Its practical use is illustrated for GaN and GaAs-based high electron mobility transistors and opto-electronic devices. We also discuss how Raman thermography is used to validate device thermal models, as well as determining the thermal conductivity of materials relevant for electronic and opto-electronic devices.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.3
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available