Journal
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume 16, Issue 4, Pages 667-684Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2016.2617458
Keywords
Thermography; thermal simulation; GaN; GaAs; HEMT; thermal management; reliability
Funding
- U.K. Engineering and Physical Sciences Research Council
- European Space Agency
- European Defense Agency
- U.S. Office for Naval Research
- Engineering and Physical Sciences Research Council [1505109] Funding Source: researchfish
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We review the Raman thermography technique, which has been developed to determine the temperature in and around the active area of semiconductor devices with submicron spatial and nanosecond temporal resolution. This is critical for the qualification of device technology, including for accelerated lifetime reliability testing and device design optimization. Its practical use is illustrated for GaN and GaAs-based high electron mobility transistors and opto-electronic devices. We also discuss how Raman thermography is used to validate device thermal models, as well as determining the thermal conductivity of materials relevant for electronic and opto-electronic devices.
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