Superior anti-corrosion performance on Cu substrate achieved by dense polypropylene coating with ultrahigh inhibition efficiency deposited via the environmental-friendly method

In this work, an environmental-friendly and one-step synthetic method are adopted for the protective coating for electronic devices. A polypropylene (PP-V) coating has been deposited on Cu substrate by plasma enhanced chemical vapor deposition (PECVD). Compared with the solvent-based methods, the PECVD method enables the transition from gaseous feedstock to solid coating, and the process does not involve polluting organic solvents. Moreover, the PP-V coating prepared by the PECVD method possesses an excellent protective effect, which is determined by the high denseness of the coating. PP-V coating delivers 99.96% ultra-high corrosion inhibition efficiency and can increase the low-frequency impedance modulus of the substrate by 3 orders of magnitude, while providing good protection after 24 h of saltwater immersion as well, which displays a good application prospect in the protection of electronic devices.

Automated summary

An environmentally friendly and one-step synthetic method is adopted for the protective coating for electronic devices in this work. The PP-V coating deposited by PECVD method shows excellent protective effect with high denseness, delivering ultra-high corrosion inhibition efficiency and significant increase in impedance modulus of the substrate. The coating also retains good protection after 24 hours of saltwater immersion, indicating promising application prospects in electronic device protection.