Experimental and numerical evaluation of conduction welded thermoplastic composite joints

The capability of joining two thermoplastic composite parts by welding is a key technology to reduce the weight and cost of assembled parts and enables high volume manufacturing of future aeronautical structures made of thermoplastic composite materials. However, there is not much experimental understanding of the mechanisms involving welded joint failure, and the computational tools available for the simulation of thermoset composites have not yet been completely assessed for thermoplastic materials. In this work, a numerical and experimental evaluation is performed to investigate the strength and failure behavior of conduction welded thermoplastic composite joints. A welded single lap shear joint is designed, manufactured, tested and analyzed proposing two distinct modeling approaches. A simplified modeling strategy which only accounts for damage at the weld is compared to a high-fidelity model which can take into account the physical failure mechanisms at the lamina level. The high-fidelity modeling methodology is able to predict the experimental failure mode of the investigated welded joints with high accuracy and is used to gain new insights into the key-variables that influence the strength of thermoplastic welded joints. It is also found that the joint strength is highly influenced by the failure mechanisms not only of the welded interface but also of the surrounding plies.

Automated summary

This study investigates the strength and failure behavior of conduction welded thermoplastic composite joints through numerical and experimental evaluation. The research finds that the joint strength is highly influenced not only by the failure mechanisms of the welded interface but also of the surrounding plies. The high-fidelity modeling methodology can predict the experimental failure mode of welded joints with high accuracy and offers new insights into the key variables influencing the strength of thermoplastic welded joints.