Journal
IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING
Volume 63, Issue 1, Pages 120-130Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TBME.2015.2406113
Keywords
Electrode array; microelectrodes; neural recording; silicon probe; spatial oversampling
Categories
Funding
- Simons Center for the Social Brain at MIT
- Paul Allen Family Foundation
- NIH [DP1NS087724, R01NS067199, 2R44NS070453-03A1, R01DA029639]
- Cognitive Rhythms Collaborative NSF DMS [1042134]
- New York Stem Cell Foundation
- NSF CBET [1053233]
- DARPA [HR0011-14-2-0004]
- NATIONAL INSTITUTE OF NEUROLOGICAL DISORDERS AND STROKE [R01NS067199, R44NS070453, DP1NS087724] Funding Source: NIH RePORTER
- NATIONAL INSTITUTE ON DRUG ABUSE [R01DA029639] Funding Source: NIH RePORTER
- Directorate For Engineering [1053233] Funding Source: National Science Foundation
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Objective: Neural recording electrodes are important tools for understanding neural codes and brain dynamics. Neural electrodes that are closely packed, such as in tetrodes, enable spatial oversampling of neural activity, which facilitates data analysis. Here we present the design and implementation of close-packed silicon microelectrodes to enable spatially oversampled recording of neural activity in a scalable fashion. Methods: Our probes are fabricated in a hybrid lithography process, resulting in a dense array of recording sites connected to submicron dimension wiring. Results: We demonstrate an implementation of a probe comprising 1000 electrode pads, each 9 x 9 mu m, at a pitch of 11 mu m. We introduce design automation and packaging methods that allow us to readily create a large variety of different designs. Significance: We perform neural recordings with such probes in the live mammalian brain that illustrate the spatial oversampling potential of closely packed electrode sites.
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