Journal
CHEMPHYSCHEM
Volume 23, Issue 3, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/cphc.202100673
Keywords
polyMOF; mechanical properties; polymer-MOF hybrid; thin film; polyUiO-66
Funding
- Laboratory Directed Research and Development Program at Sandia National Laboratories
- Defense Threat Reduction Agency [HDTRA-1929358]
- U.S. Department of Energy's National Nuclear Security Administration [DE-NA0003525]
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Metal-organic framework (MOF) thin films currently lack the mechanical stability needed for electronic device applications. This study developed a method to synthesize polyUiO-66(Zr) films and investigated their mechanical properties compared to UiO-66 thin films. The results showed that polyUiO-66 films have a lower modulus but similar hardness to UiO-66 films. Further development is needed to fully utilize the mechanical advantages of polyMOFs over MOFs. The continuous surface-supported polyUiO-66 thin films demonstrated in this work enable potential applications in sensors and devices.
Metal-organic framework (MOF) thin films currently lack the mechanical stability needed for electronic device applications. Polymer-based metal-organic frameworks (polyMOFs) have been suggested to provide mechanical advantages over MOFs, however, the mechanical properties of polyMOFs have not yet been characterized. In this work, we developed a method to synthesize continuous sub-5 mu m polyUiO-66(Zr) films on Au substrates, which allowed us to undertake initial mechanical property investigations. Comparisons between polyUiO-66 and UiO-66 thin films determined polyUiO-66 thin films exhibit a lower modulus but similar hardness to UiO-66 thin films. The initial mechanical characterization indicates that further development is needed to leverage the mechanical property advantages of polyMOFs over MOFs. Additionally, the demonstration in this work of a continuous surface-supported polyUiO-66 thin film enables utilization of this emerging class of polyMOF materials in sensors and devices applications.
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