Journal
IEEE SENSORS JOURNAL
Volume 16, Issue 24, Pages 8840-8846Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSEN.2016.2578936
Keywords
Piezoelectric films; screen printing; strain sensor array; structural health monitoring; transfer printing; ultra-thin
Funding
- New Energy and Industrial Technology Development Organization through the Road Infrastructure Monitoring System Development Project
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In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. Using these methods, one can mount not only ultra-thin microsensors but also microcontroller and amplifier chips required for sensor device fabrication. We successfully transfer-printed a very fragile microelectromechanical systems-based 5-mm-long, 1-mm-wide, 5-mu m-thick high-aspect-ratio ultra-thin Pb(Zr, Ti)O3 (PZT) (1.9 mu m)/Si ( 3 mu m) strain sensor onto a flexible printed-circuit (FPC) substrate with etched Cu wiring. Then, we connected the sensor to the wiring by printing a conductive paste using a screen printer. Large ferroelectric polarization-voltage hysteresis curves were obtained even after the transfer printing process. Since an output voltage corresponding to the magnitude of the strain from the developed sensor was generated, it was confirmed that ultra-thin sensors could be integrated to the FPC substrate by these transfer and screen printing techniques without damage. The PZT thin films have shown 0.18 mV/ mu epsilon of dynamic strain sensitivity according to the resonant vibration of the stainless plate.
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