Journal
APPLIED SURFACE SCIENCE
Volume 570, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.apsusc.2021.151220
Keywords
Cu nanoparticles; MOD; Sintering; Bonding; Shear strength
Categories
Funding
- National Natural Science Foundation of China [51805197]
- GuangDong Basic and Applied Basic Research Foundation [2020A1515111003]
Ask authors/readers for more resources
This paper introduces a new type of self-reducible Cu nanoparticle paste, which achieves reliable Cu-Cu joints under different temperature and time conditions at high temperatures. The proposed MOD assisted self-reduction and sintering mechanism provides effective theoretical support for the practical application of Cu-Cu bonding.
The development of WBG (wide bandgap) semiconductors has put forward higher requirements for packaging and interconnection technology. Cu sintering is widely considered as an advanced interconnection technology which can be used in high temperature and high power density service. In this paper, a new type of self-reducible Cu nanoparticle paste was proposed to solve the problems of easy oxidation and high sintering temperature of normal Cu nanoparticles. The proposed Cu paste was developed by mixing formic acid treated Cu nanoparticles, reducing solvents and MOD (metal organic decomposition) solutions. Based on the new type of self-reducible Cu nanoparticle paste, Cu-Cu bonding experiments were carried out with different bonding temperature and time, and a reliable Cu-Cu joint with a high shear strength of 52.01 MPa can be achieved at 250 degrees C under ambient condition, without any assistance of reducing or inert atmosphere. In addition, the MOD assisted self-reduction and sintering mechanism was proposed after shear strength testing, element composition analyzing, crosssectional morphology and fracture structure observation, which can provide an effective theoretical support for the practical application of Cu-Cu bonding.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available