4.6 Article

Deformation of 4H-SiC: The role of dopants

Journal

APPLIED PHYSICS LETTERS
Volume 120, Issue 5, Pages -

Publisher

AIP Publishing
DOI: 10.1063/5.0083882

Keywords

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Funding

  1. National Key Research and Development Program of China [2017YFA0205704]
  2. Natural Science Foundation of China [91964107, 61774133]
  3. Fundamental Research Funds for the Central Universities [2018XZZX003-02]
  4. Natural Science Foundation of China for Innovative Research Groups [61721005]
  5. Zhejiang University Education Foundation Global Partnership Fund

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The role of dopants on deformation and mechanical properties of 4H silicon carbide (4H-SiC) was investigated using nanoindentation. It was found that different dopants can significantly affect the hardness, elastic modulus, and fracture toughness of 4H-SiC, as well as the formation of dislocations and cracks during nanoindentation. Moreover, polymorph transitions from 4H-SiC to amorphous SiC and 3C-SiC were observed. These findings provide valuable insights for the design of processing methods for differently doped 4H-SiC substrate wafers.
The role of dopants on deformation and mechanical properties of 4H silicon carbide (4H-SiC) is proposed by using nanoindentation. It is found that the hardness, elastic modulus, and fracture toughness of 4H-SiC substrate wafers all decrease on the order of vanadium (V) doping, undoping, and nitrogen (N) doping. For all three types of 4H-SiC, basal plane dislocations (BPDs), threading edge dislocations, and cracks are formed during the nanoindentation. Polymorph transitions from 4H-SiC to amorphous SiC and 3C-SiC are found as the penetration depth of the indent increases from the subsurface to the deeper region. N doping is found to weaken the bond strength of 4H-SiC, which enhances the glide and piling up of BPDs in nanoindentated N-doped 4H-SiC. In contrast, V doping effectively hinders the glide of BPDs, which accumulates a high-stress field and facilitates the polymorph transition from 4H-SiC to 3C-SiC and amorphous SiC. The insight on the effects of dopants on the deformation and mechanical properties of 4H-SiC may help the design of the processing of differently doped 4H-SiC substrate wafers. Published under an exclusive license by AIP Publishing.

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