Comprehensive impedance spectroscopy equivalent circuit of a thermoelectric device which includes the internal thermal contact resistances

Thermoelectric devices are widely used as solid-state refrigerators and have potential energy generation applications. Their characterization is key to develop more efficient devices and monitor their performance. Electrical impedance spectroscopy has been proved to be a useful method for the characterization of thermoelectric modules. However, deviations from current impedance models still exist in experimental results, especially in the high frequency part of the impedance spectrum, which limits its use. Here, we present a new comprehensive impedance model (equivalent circuit) which covers all the key phenomena that affects the module performance, and it is able to explain the observed deviations. The new equivalent circuit includes, as new additions, the thermal influence of the metallic strips (electrodes), combined with the thermal contact resistance between the metallic strips and the outer ceramic layer. Moreover, a new more accurate spreading-constriction impedance element, which considers the variation of the heat flow in the radial direction at the outer ceramic surfaces, is also developed. The comprehensive equivalent circuit was used to perform fittings to impedance spectroscopy measurements of modules fabricated by different manufacturers. From the fittings, it was possible to identify, among other key properties, the internal thermal contact resistances, whose direct determination is very challenging. Thermal contact resistivities at the metallic strips/thermoelectric elements interface in the range 2.20 x 10-6-1.26 x 10-5 m2KW-1 were found. An excellent thermal contact was identified at the metallic strips/ceramic layers. This opens up the possibility of using impedance spectroscopy as a powerful tool to evaluate, monitor, and identify issues in thermoelectric devices.

Automated summary

A new comprehensive impedance model has been proposed in this study to provide a more thorough description of thermoelectric module performance and explain existing deviations. Through fittings to modules fabricated by different manufacturers, key properties such as internal thermal contact resistances were successfully identified.