Journal
IEEE ELECTRON DEVICE LETTERS
Volume 37, Issue 11, Pages 1466-1469Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2016.2614515
Keywords
GaN; vertical transistor; MOSFET; power semiconductor devices
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Funding
- ARPA-E SWITCHES Program [DE-AR000450]
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This letter reports a GaN vertical trench metal-oxide-semiconductor field-effect transistor (MOSFET) with normally-off operation. Selective area regrowth of n(+)-GaN source layer was performed to avoid plasma etch damage to the p-GaN body contact region. A metal-organic-chemicalvapor-deposition (MOCVD) grown AlN/SiN dielectric stack was employed as the gate oxide. This unique process yielded a 0.5-mm(2)-active-area transistor with threshold voltage of 4.8 V, blocking voltage of 600 V at gate bias of 0 V, and on-resistance of 1.7 Omega at gate bias of 10 V.
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