Journal
IEEE ELECTRON DEVICE LETTERS
Volume 37, Issue 5, Pages 636-639Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2016.2548488
Keywords
GaN-on-Si; p-i-n diodes; rectifiers; power electronics; vertical devices; Si removal
Categories
Funding
- National Natural Science Foundation of China [51507131]
- [T23-612/12-R]
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Using GaN-on-Si epilayers, for the first time, fully vertical p-i-n diodes are demonstrated after Si substrate removal, transfer, and n-electrode formation at the top of the device. After SiO2 sidewall passivation, the vertical p-i-n diodes, with n-GaN facing up, exhibit V-ON of 3.35 V at 1 A/cm(2), a low differential ON-resistance of 3.3 m Omega cm(2) at 300 A/cm(2), and a breakdown voltage of 350 V. The corresponding Baliga's figure of merit is 37.0 MW/cm(2), a very good value for GaN-based p-i-n rectifiers grown on Si substrates. The results indicate that fully vertical rectifiers using GaN-on-Si epilayers have great potential in achieving cost-effective GaN devices for high-power and high-voltage applications.
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