4.6 Article

Flexible Carbon-Based 3D Conductive Network Structure Blade-Coated on Poly(ethylene terephthalate) Substrate for Light-Emitting Electronic Devices

Journal

ADVANCED ENGINEERING MATERIALS
Volume 24, Issue 7, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adem.202101355

Keywords

carbon-based epoxy composites; conductive channel network; flexible light-emitting electronics; fluid ink

Funding

  1. Opening Project of Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing [2021kfkt03]
  2. South China University of Technology, China

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This study demonstrates the use of blade-coated conductive ink on poly(ethylene terephthalate) substrate to fabricate flexible light-emitting electronic devices. The unique feature of the ink is its high-performance 3D conductive channel network with low resistance, achieved by combining carbon-based fillers and epoxy resin. The carbon-based channels in the conductive composites exhibit excellent resistance reliability and durability under bending, ultrasonic treatment, and exposure to organic solvents. Thus, this work presents a new solution for the development of high-efficiency, low-cost, large-scale production of flexible electronics.
Herein, the blade-coated conductive ink on poly(ethylene terephthalate) substrate with unique features is demonstrated, aiming at the fabrication of flexible light-emitting electronic devices. The inks are prepared by combining carbon-based fillers and epoxy resin to achieve a high-performance 3D conductive channel network with low resistance. The carbon-based channels in the conductive composites withstand 2000 bending-releasing cycles (bending radius of 10 mm); excellent resistance reliability with the value of R/R (0) is 1.059. Moreover, carbon-based epoxy composites also possess a mechanical fastness under ultrasonic treatment and chemical durability to various organic solvents and have an excellent performance in the application of light-emitting electronic devices. Here, this work provides a new solution for the development of high-efficiency, low-cost, large-scale production of flexible electronics.

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