Journal
ADVANCED ENGINEERING MATERIALS
Volume 24, Issue 9, Pages -Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adem.202101678
Keywords
electrical conductivity; liquid metals; thermal conductivity; thermal management
Categories
Funding
- National Natural Science Foundation of China [51973109, 51521004, 51873105]
- Innovation Program of Shanghai Municipal Education Commission [2019-01-07-00-02-E00069]
- Center of Hydrogen Science of Shanghai Jiao Tong University
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This article presents a systematic study on the impact of structural engineering of metallic copper fillers on the thermal and electrical performance of gallium-based liquid metal composites. By optimizing the size, shape, and amount of fillers, significant enhancements in thermal conductivity and electrical conductivity can be achieved, leading to improved heat dissipation performance in electronic devices.
This article presents a systematic study on the impact of structural engineering of metallic copper fillers on the thermal and electrical performance of gallium-based liquid metal composites. Herein, the copper fillers are directly blended into liquid metal matrix in air. Spherical copper filler is selected as a filler model to explore the influence of the size and amount of filler on the thermal conductivity of liquid metal composites. The significant enhancement in both thermal conductivity (approximate to 301% enhancement, 54.2 W m(-1) K-1, 51 vol%, 100 mu m of spherical copper) and electrical conductivity (approximate to 163% enhancement, 5.18 S mu m(-1)) can be achieved by optimizing size, shape, and amount of the fillers. The as-prepared copper filler-liquid metal composite shows distinguished heat dissipation performance in the thermal management of electronic devices. This work may also help to expand their usage in a wide range of applications, including thermal management systems, biomedical systems, and smart robotics.
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