Journal
ACS APPLIED POLYMER MATERIALS
Volume 3, Issue 9, Pages 4430-4435Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsapm.1c00737
Keywords
epoxy resin; thermal conductivity; molecular structure; semicrystal; crystallinity; minimum thermal conductivity model
Funding
- ALTANA Institute
- National Science Foundation Engineering Research Center for Power Optimization of Electro Thermal Systems (POETS) [EEC-1449548]
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Polymer materials with enhanced thermal conductivity are highly sought after for thermal management of electronic devices. This study successfully developed epoxy resins with a thermal conductivity of 0.52 W/(m K), which is 2.5 times higher than common polymers. It was found that the thermal conductivity and density of these epoxy resins have a positive correlation with crystallinity.
Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (similar to 0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is similar to 2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.
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