Test for Reliability for Mission Critical Applications

Test for Reliability is a test flow where an Integrated Circuit (IC) device is continuously stressed under several corner conditions that can be dynamically adapted based on the real-time observation of the critical signals of the device during the evolution of the test. We present our approach for a successful Test-for-Reliability flow, going beyond the objectives of the traditional reliability approach, and covering the entire process from design to failure analysis.

Automated summary

Test for Reliability involves continuously stressing an IC device under various corner conditions and dynamically adjusting the test based on real-time observation of critical signals. Our approach goes beyond traditional reliability methods, covering the entire process from design to failure analysis.