4.6 Article

Effect of laser processing microstructure on the bonding strength and failure mode of 7075-T6 aluminum alloy adhesive joints

Journal

JOURNAL OF MANUFACTURING PROCESSES
Volume 66, Issue -, Pages 302-312

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.jmapro.2021.04.028

Keywords

Laser processing; Microstructure; 7075-T6 Al alloy; Strength of adhesive joint; Failure mode

Funding

  1. National Key R&D Program of China [2018YFB1107700]
  2. National Natural Science Foundation of China [U1608259]
  3. Science and Technology Planning Project of Guangdong Province [2017KZ010103]
  4. Science and Technology Planning Project of Sihui City [2018020103]
  5. Guangdong Basic and Applied Basic Research Foundation [2020A1515011553]
  6. Scientific Research and Technological Development Planning of Fangchenggang City [AB20014009]

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The study found that the CA microstructure is most conducive to improving shear strength, while the MG microstructure only leads to cohesive failure in the entire region when the groove distance is 0.
The strength of adhesive joints of aluminum (Al) alloys can be enhanced by laser surface treatment. In this study, a nanosecond fiber laser was used to process crater array (CA), multi-groove (MG), and crater-array-multigroove (CA-MG) microstructures on 7075-T6 Al alloy substrates. The shear strength (a) was measured by a single-lap shear test. For the CA microstructure, how the pulse energy (E) and crater overlap rate (6) affect a was studied. For the MG and CA-MG microstructures, how E and the groove distance (H) affect a was studied. Also, the mechanism by which the characteristic parameters of each microstructure affect a was compared through the failure mode. The results show that when 6 = 30 %, the CA microstructure is the most conducive for improving the shear strength; however, regardless of the choice of E and 6, the CA microstructure leads to cohesive failure in part of the bonding region. The MG microstructure leads to cohesive failure in the entire bonding region only when H = 0; when H = 40 or 80 mu m, the region outside the grooves is prone to adhesive failure. Regardless of the choice of E and H, the CA-MG microstructure formed by two-step laser processing leads to cohesive failure in the entire bonding region. From the perspective of improving efficiency and saving energy, E = 880 mu J and 6 = 30 % should be selected for processing the CA microstructure and E = 176 mu J and H =80 mu m should be selected for processing the MG microstructure.

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